Customized Educational Music Books for Language Learning
Customized educational music books designed specifically for language learning applications.
Product Specifications
Material
Art Paper/Coated Paper/Offset Paper
Printing
CMYK full color printing, pantone color printing
Finishing
Gloss film lamination, Matt film lamination, Gold foil stamping, Debossing, Embossing, Spot UV coating, Hot foil stamping, Glittering
Binding
Perfect binding, sewing binding, stapled, or as per your requirement
Artwork
PDF, Adobe Illustrator, Adobe InDesign, Photoshop, Higher than 300dpi
Payment Terms
T/T, Paypal, Western Union, L/C all available
Packaging Details
Packed by carton, then with plastic pallet. Custom packaging available upon request
Applications
Similar Products
Company Profile
Tung Wing Electronic(Shenzhen) Co., Ltd., founded in 1987, specializes in product research and development, mold making, manufacturing and exporting. We maintain comprehensive departments including engineering, molding sampling, plastic, SMT, bonding, silkscreen, pad printing, assembling, marketing, QA, and QC. In addition to standard products, we offer OEM and ODM services with voice and melody chips. Our products, primarily exported to Europe, USA, South Eastern Asia, and Japan, include gifts and toys with flashing, sound, and recording functions. We have been a member of ICTI since June 2006.
Certifications
Frequently Asked Questions
Are you a direct factory?
Yes! We are a 100% manufacturer specialized in printing and packaging with over 26 years of experience.
What is your minimum order quantity?
Our standard MOQ is 3,000 sets per item.
How do you package and transport products?
We pack products in strong carton boxes. Delivery options include sea transportation, air freight, and express delivery.
Can we add our brand logo to the product?
Yes, you can OEM the box. For product logo placement, please contact our manager to discuss MOQ requirements.
What is the lead time for products?
Delivery time ranges from 15 to 45 days depending on quantity and design complexity.
